CMP是什么意思
網(wǎng)絡(luò)釋義：冠軍；共中心點(diǎn)；金屬波紋管；凸輪軸轉(zhuǎn)角傳感器
1 . The CMP process is also used to control film thickness and removal of barrier layers.
CMP技術(shù)也用于控制薄膜厚度及剝離隔離層.
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2 . The copper chemical - mechanical polishing ( CMP ) which is the key planarization technology for ULSI manufacturing was discussed.
對(duì)用于甚大規(guī)模集成電路(ULSI) 制造的關(guān)鍵平坦化工藝———銅化學(xué)機(jī)械拋光 ( CMP) 技術(shù)進(jìn)行了討論.
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3 . Mathematical models were developed to simulate particle reduction in CMP slurry distribution systems.
為模擬cmp磨料 分配系統(tǒng)的粒子減少開發(fā)了數(shù)字模型.
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4 . Recent investigation shows that CeC & gt ; 2 nanoparticles can be used as CMP slurry to polish IC chip.
最新研究表明,納米 CeO _2可用于集成電路芯片加工的化學(xué)機(jī)械拋光(CMP)漿料.
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5 . This article take the technology of the single chip multi - processor ( CMP ) as a master line.
以單芯片 多處理器 ( CMP) 技術(shù)為主線,綜述了多核架構(gòu)未來發(fā)展趨勢(shì)及其技術(shù)走向.
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